Wiren Board 8 hardware revisions

Identifying the hardware revision

You can identify the controller hardware revision in several ways:

Read the label on the front panel.
In the controller web interface, open Devices → System → HW Revision.

Using MQTT, enter this command in the console:

# mosquitto_sub -h localhost -p 1883 -v -t "/devices/system/controls/HW Revision"
/devices/system/controls/HW Revision 6.7.2

For a remote controller, replace localhost with the required controller's IP address.

When connecting to the controller over SSH, the board revision appears in green in the welcome banner.

Wiren Board 8 revisions

Revision	Batches	Release date	Identification	Changes from the previous revision	Software identifier
8.5.3	2GB RAM + 16GB eMMC: v8.5.3K/2G2, v8.5.3K/2G3 2GB RAM + 32GB eMMC: v8.5.3M/2G, v8.5.3M/2G1, v8.5.3M/2GC	09.2026 - ...	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.4.	RAM type changed from LPDDR4X to DDR3	8x
8.5.3	128MB RAM + 512MB SDNAND: v8.5.3L, v8.5.3L/1 ...	08.2026 - ...	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.4.	Customer-specific version with one Ethernet port and without Wi-Fi, CAN, security chip, heatsink, software-controlled termination on RS485-1, open-collector outputs on A1–A4, or the MOD4 terminal block; processor does not support HDMI 1-Wire protection diodes changed from SMAJ5.0CA to SMAJ5.0A ERRWB85001	8x
8.5.3	4GB RAM + 64GB eMMC: v8.5.3J/4GD, v8.5.3K/4G, v8.5.3K/4G1, v8.5.3K/4G2, v8.5.3M/4G, v8.5.3M/4G1, v8.5.3M/4G2, v8.5.3M/4G3...	08.2026 - ...	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.3.	1-Wire protection diodes changed from SMAJ5.0CA to SMAJ5.0A ERRWB85001	8x
8.5.3	2GB RAM + 16GB eMMC: v8.5.3J/2GD, v8.5.3K/2GD	08.2026 - 09.2026	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.3.	1-Wire protection diodes changed from SMAJ5.0CA to SMAJ5.0A ERRWB85001	8x
8.5.3	2GB RAM + 16GB eMMC: v8.5.3G/2G2, v8.5.3J/2G, v8.5.3J/2G2, v8.5.3K/2G, v8.5.3K/2G1, v8.5.3K/2G1D	07.2026 - 08.2026	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.3.	RAM type changed from LPDDR4 to LPDDR4X	8x
8.5.3	256MB RAM + 512MB SDNAND: v8.5.3H 128MB RAM + 512MB SDNAND: v8.5.3H/1	06.2026 - 08.2026	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.4.	Customer-specific version with one Ethernet port and without Wi-Fi, CAN, security chip, heatsink, software-controlled termination on RS485-1, open-collector outputs on A1–A4, or the MOD4 terminal block; processor does not support HDMI RAM type changed from LPDDR4 to DDR3	8x
8.5.3	2GB RAM + 32GB eMMC: v8.5.3K/2GS, v8.5.3K/2GS1	08.2026 - ...	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.4.	Customer-specific version without processor-board heating RAM type changed from LPDDR4 to DDR3	8x
8.5.3	2GB RAM + 16GB eMMC: v8.5.3B/2GS, v8.5.3B/2GS1	10.2025 - ...	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Customer-specific version without processor-board heating	8x
8.5.3	4GB RAM + 64GB eMMC: v8.5.3A/4G, v8.5.3A/4G1, v8.5.3B/4G, v8.5.3B/4G1, v8.5.3B/4G2, v8.5.3C/4G, v8.5.3C/4G1, v8.5.3D/4G, v8.5.3D/4G1, v8.5.3D/4G2, v8.5.3D/4G3, v8.5.3D/4G4, v8.5.3F/4G, v8.5.3F/4G1, v8.5.3F/4G2, v8.5.3F/4G3, v8.5.3G/4G, v8.5.3G/4G2, v8.5.3G/4G3, v8.5.3G/4G4, v8.5.3G/4G5, v8.5.3G/4G6, v8.5.3G/4G7, v8.5.3J/4G, v8.5.3J/4G1, v8.5.3J/4G2, v8.5.3J/4G3 2GB RAM + 16GB eMMC: v8.5.3A/2G, v8.5.3B/2G, v8.5.3C/2G, v8.5.3C/2G1, v8.5.3C/2G2, v8.5.3D/2G, v8.5.3D/2G1, v8.5.3D/2G2, v8.5.3D/2G3, v8.5.3D/2G4, v8.5.3D/2G5, v8.5.3F/2G, v8.5.3F/2G1, v8.5.3F/2G2, v8.5.3F/2G3, v8.5.3F/2G4, v8.5.3G/2G, v8.5.3G/2G1	09.2025 - 08.2026	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Minor internal changes	8x
8.5.3	512MB RAM + 2GB eMMC: v8.5.3E/1, v8.5.3E/2 512MB RAM + 4GB eMMC: v8.5.3E, v8.5.3E/4D 512MB RAM + 8GB eMMC: v8.5.3E/3, v8.5.3E/3D, 8.5.3F/C	12.2025 - 06.2026	Marked r.8.5.3 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Customer-specific version with one Ethernet port and without Wi-Fi, CAN, security chip, heatsink, software-controlled termination on RS485-1, open-collector outputs on A1–A4, or the MOD4 terminal block; processor does not support HDMI	8x
8.5.2	2GB RAM + 16GB eMMC: v8.5.2C/2GS	07.2025	Marked r.8.5.2 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Customer-specific version without processor-board heating	8x
8.5.2	512MB RAM + 4GB eMMC: v8.5.2A	05.2025 - 06.2025	Marked r.8.5.2 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Customer-specific version with one Ethernet port and without Wi-Fi, CAN, security chip, heatsink, software-controlled termination on RS485-1, open-collector outputs on A1–A4, or the MOD4 terminal block; processor does not support HDMI	8x
8.5.2	2GB RAM + 16GB eMMC: v8.5.2B/2G, v8.5.2C/2G, v8.5.2C/2G1	04.2025 - 06.2025	Marked r.8.5.2 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Minor internal changes. Processor does not support HDMI.	8x
8.5.2	4GB RAM + 64GB eMMC: v8.5.2B/4G, v8.5.2C/4G, v8.5.2C/4G1, v8.5.2C/4G2, v8.5.2D/4G, v8.5.2D/4G1, v8.5.2D/4G2 2GB RAM + 16GB eMMC: v8.5.2B/2G1, v8.5.2B/2G2, v8.5.2B/2G3, v8.5.2C/2GA, v8.5.2C/2GA1, v8.5.2C/2GS1, v8.5.2D/2G, v8.5.2E/2G, v8.5.2E/2G1	04.2025 - 08.2025	Marked r.8.5.2 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Minor internal changes	8x
8.5.1	512MB RAM + 4GB eMMC: v8.5.1E/1, v8.5.1E/2, v8.5.1E/2A	03.2025 - 05.2025	Marked r.8.5.1 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Customer-specific version with one Ethernet port and without Wi-Fi, CAN, security chip, heatsink, software-controlled termination on RS485-1, open-collector outputs on A1–A4, or the MOD4 terminal block; processor does not support HDMI	8x
8.5.1	2GB RAM + 16GB eMMC: v8.5.1D/2GR 4GB RAM + 64GB eMMC: v8.5.1D/4G, v8.5.1D/4GR	11.2024 - 04.2025	Marked r.8.5.1 on the underside of the PCB. Processor board marked WB-T507 v1.3.	Video-output connector changed on the processor board.	8x
8.5.1	2GB RAM + 16GB eMMC: v8.5.1B/2G, v8.5.1C/2G, v8.5.1C/2GS, v8.5.1C/2GR, v8.5.1D/2G, v8.5.1D/2GS 4GB RAM + 64GB eMMC: v8.5.1B/4G, v8.5.1C/4G, v8.5.1C/4G1	11.2024 - 04.2025	Marked r.8.5.1 on the underside of the PCB. Processor board marked WB-T507 v1.2.	Standard WB8 version	8x
8.5.1	2GB RAM + 16GB eMMC: v8.5.1A/T	09.2024	Marked r.8.5.1 on the underside of the PCB. Processor board marked WB-T507 v1.2.	Test batch Four terminal blocks for expansion modules MOD1…MOD4 MOD1 and MOD2 now support UART expansion modules; MOD3 and MOD4 support I2C Processor-board heating added for startup and operation from −40 °C The two USB-C connectors replaced with one Debug USB connector combining both functions Buzzer connected to WBEC for feedback on power-on, reboot and button presses CAN is not included in the standard configuration but can be added using expansion modules	8x
8.4.4	4GB RAM + 64GB eMMC Ind: v8.4.4A/4GI, v8.4.4B/4G	07.2024 - 08.2024	Marked r.7.4.4 on the underside of the PCB. Processor board marked WB-T507 v1.2.	Customer-specific version without WiFi	8x
8.4.4	4GB RAM + 64GB eMMC Ind: v8.4.4A/4GK, 8.4.4B/4GA, v8.4.4B/4G1, v8.4.4C/4G, v8.4.4D/4G, v8.4.4E/4G, v8.4.4E/4G1, v8.4.4F/4G, v8.4.4F/4GT 2GB RAM + 16GB eMMC Ind: v8.4.4A/2G, v8.4.4A/2G1, v8.4.4B/2G, v8.4.4B/2G1, v8.4.4C/2G, v8.4.4D/2G, v8.4.4D/2GA	07.2024 - 11.2024	Marked r.7.4.4 on the underside of the PCB. Processor board marked WB-T507 v1.2.	Cause of a possible short circuit when fitting the processor module eliminated ERRWB84002 Enclosure cutout for the SD card slightly changed	8x
8.4.4	4GB RAM + 64GB eMMC Ind: v8.4.4A/4G	07.2024	Marked r.7.4.4 on the underside of the PCB. Processor board marked WB-T507 v1.2.	Incompatibility with some Ethernet switch/router models fixed ERRWB84001 USB Type-C connectors changed Heatsink fastened with nuts instead of standoffs	8x
8.4.3	4GB RAM + 64GB eMMC Ind: v8.4.3A/4G, v8.4.3A/4G1, v8.4.3A/4G2	05.2024 - 07.2024	Marked r.7.4.3 on the underside of the PCB. Processor board marked WB-T507 v1.2.	First production batch	8x
8.4		04.2024	Marked Wiren Board 8 r.4.1 on the underside of the PCB.	Test batch. Hardware restrictions limit MOD1 to WBE2-DI-DR-3, WBE2-DO-R3A-1, WBE2-DO-R6C-1 and WBE2-DO-SSR-2. MOD2 and MOD3 are unrestricted; MOD4 is inoperative.	8x

Changes from Wiren Board 7 to Wiren Board 8

General changes	Added	Removed
Allwinner A40i replaced by Allwinner T507: four 1.5 GHz 64-bit Cortex-A53 cores instead of four 1.2 GHz 32-bit cores. RAM increased to 1 GB as standard, with 4 GB optional. Expansion-module connectors are unchanged. The backup-power connector and modules changed. WB8.4 uses WBMZ5-series modules; WB8.5 uses WBMZ6-series modules. HDMI video output added.