WB-MRM2-mini hardware revisions

Hardware revision is shown on the enclosure side label and PCB.

Revision	Batches	Production period	Changes from the previous revision	Photo
2.5	NC version: v2.5A, v2.5B - ...	06.2026 -	Molded enclosure construction Minor internal changes
2.4	NO version: v2.4J/2, v2.4K, v2.4L - ...	04.2026 - ...	Molded enclosure construction
2.4	NO version: v2.4E, v2.4F, v2.4H, v2.4J, v2.4J/1	10.2025 - 04.2026	Batch in new enclosures
2.4	NC version: v2.4D/1, v2.4G	09.2025 - 06.2026	Batch in new enclosures
2.4	NO version: v2.4B, v2.4B/1	08.2025 - 10.2025	AT24C02M5/TR EEPROM removed
2.4	NC version: v2.4C, v2.4D	08.2025 - 09.2025	AT24C02M5/TR EEPROM removed
2.4	NC version: v2.4A	05.2024 - 08.2025	Minor internal changes
2.3	NC version: v2.3V	02.2024 - 05.2024	Separate PCB for the NC version
2.3	NO version: v2.3M, v2.3N, v2.3O, v2.3Q, v2.3S, v2.3U, v2.3W, v2.3X, v2.3X/1, v2.3Y, v2.3Y/1, v2.3Z, v2.3Z/1 NC version: v2.3L, v2.3P, v2.3R, v2.3T	10.2022 - 04.2025	Different serial-number format (EEPROM IC changed)
2.3	NO version: v2.3B, v2.3C, v2.3D, v2.3G, v2.3H, v2.3I, v2.3J NC version: v2.3E, v2.3F, v2.3K	07.2021 - 10.2022	GD32 replaces STM32 microcontroller
No new features; final firmware 1.20.4 dated 7 November 2023
2.3	v2.3A	06.2021	Higher-power relays HF32FV-16/5-HLTF(590) for the /NO version, with inrush current up to 80 A for 20 ms
2.1	v2.1F	01.2021 - 05.2021	Added pull-up resistors to control transistors
2.1	v2.1A - v2.1E	11.2019 - 12.2020	Terminal blocks replaced with pluggable types Added LED beneath the terminal block Relay module length 52 mm
1.4	273, 329, v1.4A - v1.4B	10.2018 - 10.2019	With nonvolatile memory IC No LED
1.3	183, 203, 224	10.2017 - 09.2018	NC relay version introduced
1.1-1.2	148	Before September 2017	Initial versions: length 46 mm; green LED beneath heat-shrink tubing	-