WB-MR6C v.3 hardware revisions

The batch number (Batch No.) is shown on a label on the side of the enclosure or on the printed circuit board.

Revision	Batches	Production period	Changes from the previous revision
v4.4	v4.4F/3, v4.4G, v4.4G/1, v4.4G/2, v4.4G/3, v4.4H, v4.4H/1, v4.4J, v4.4J/1, v4.4J/2, v4.4J/3, v4.4J/4, v4.4K, v4.4K/1, v4.4K/2, v4.4L, v4.4L/1, v4.4L/2, v4.4M, v4.4M/1, v4.4M/2, v4.4M/3 - ...	09.2025 - ...	Batch using enclosures with a matte surface
v4.4	v4.4D, v4.4D/2, v4.4D/3, v4.4E, v4.4E/1, v4.4E/2, v4.4F, v4.4F/1, v4.4F/2	05.2025 - 09.2025	Device without EEPROM memory chip
v4.4	v4.4A, v4.4A/1, v4.4A/2, v4.4B, v4.4B/1, v4.4B/2, v4.4C, v4.4C/1, v4.4C/2, v4.4C/3, v4.4C/4, v4.4D/1	11.2024 - 05.2025	Minor internal changes
v4.3	v4.3A, v4.3A/2, v4.3B, v4.3B/2, v4.3C, v4.3C/1, v4.3C/2, v4.3D, v4.3D/1, v4.3E, v4.3F, v4.3F/1, v4.3G, v4.3G/1, v4.3H, v4.3H/1,v4.3I, v4.3I/1, v4.3J, v4.3J/1, v4.3J/2, v4.3K, v4.3L, v4.3L/1, v4.3M, v4.3M/1, v4.3N	10.2022 - 11.2024	Minor PCB routing changes
v4.2	v4.2D/2	09.2022	New EEPROM chip and serial number format
v4.2	v4.2A, v4.2B, v4.2C, v4.2D	06.2022 - 08.2022	First version